MST Device Assembly and Platforms
Class 3 electronic assemblies set the standard for the highest levels of performance, durability and precision. A testament to our expertise, they embody our commitment to technological excellence.
Our specialized capabilities extend to active implant manufacturing, where reliability is key. With Class 3 standards, we ensure that every component meets the strictest quality requirements for critical applications-because in life-saving technology, failure is not an option.
Discover how our expertise drives innovation and confidence in the most demanding environments.
Semiconductor Packaging
Semiconductor packaging is a critical component that ensures functionality, reliability and performance. It protects the semiconductor from environmental hazards, supports electrical performance, and plays a key role in heat dissipation.
At MST, we specialize in semiconductor packaging solutions designed to meet the challenges of today and tomorrow. Our team of experts leverages the latest in materials science, engineering and manufacturing techniques to deliver high-performance, reliable and cost-effective packaging options for a wide range of applications.
We work closely with our customers throughout the development process, from initial concept to final production, to ensure that each package is designed for optimum performance and reliability.
If you're looking to push the boundaries of what's possible and change the electronics landscape, we invite you to join us on this exciting journey.
PCB Assembly
Our Class 3 PCB assembly services deliver the highest levels of reliability, durability, and precision. Designed for mission-critical applications such as medical implants, aerospace, and industrial technology, these assemblies meet the most stringent industry standards.
With advanced manufacturing processes, strict quality control, and expertise in high-reliability electronics, we ensure exceptional performance and longevity in the most demanding environments.