Micro Systems Engineering GmbH Complex LTCC (low temperature co-fired ceramic) substrates along with advanced assembly and semiconductor packaging processes
Profile
Since 1984 MSE has specialized in customer-specific solutions for advanced microelectronics. The company belongs to the leading European suppliers of complex LTCC (Low Temperature Co-fired Ceramics) substrates, advanced board assembly and semiconductor packaging technologies.
From the early days until now, the manufacture of electronic modules for implantable active devices at the highest quality level has been one of main business segments. MSE has focused on excellence ever since.
Further, MSE has always been convinced that all the knowledge, experience and dedication mandatory in medical device production should also be available to customers of other industries who likewise expect leading-edge production technology. The company applies the expertise and experience it has gained in medical technology to every sector where high reliability, miniaturization, high temperatures, high frequencies or hermetic encapsulation play an important role.
MSE supports its customers as a partner from the concept phase through prototyping to volume production, from design support through quality management to procurement.
Based on customer-specific requirements, MSE offers all the key processes needed to manufacture an electronic module from one source:
- Design service for ceramic and organic substrates, as well as others such as thin film, DCB, etc.
- Substrate manufacturing: LTCC (low-temperature co-fired ceramics) and thick film
- Advanced assembly processes such as SMT, flip chip, wire bonding, die attach, etc. on any base materials
- Packaging processes for BGA (ball grid arrays), LGA (land grid arrays), QFP (quad flat packages), etc.
- Special services including customer-specific tests, project management, validation, materials procurement on a worldwide basis, etc.
The most modern production lines, comprehensive test and inspection equipment, 100 percent traceability for processes and materials guarantee top-level solutions in microelectronics.
With some 300 skilled workers, technicians, engineers and scientists MSE has the critical mass for all key processes, still maintaining the efficiency and flexibility of a mid-sized enterprise. MSE has its headquarters in Berg (Upper Franconia), roughly 60 km north of Bayreuth, Germany. The facility located there has a total floor space of 6’000 m2. MSE is ISO 13485, ISO 9001 and ISO 50001 certified.
Facts & Figures
| Foundation | 1984 |
| Headquarters | D-95180 Berg (Northern Bavaria), Germany |
| Business premises | 6000 m2, including 2500 m2 clean room |
| Employees | 300 |
| Products & services |
|
| Main export markets | Europe, USA |
| Management | Thomas Asperger |
| Quality standards |
|
| Memberships | Cluster Mikrosystemtechnik, iMAPS Germany, iMAPS International, INNOMAG, DVS, MEPTEC, SMTA |
Engeneering
Design services
MSE offers concepts and design support for the following technologies:
- LTCC (substrates manufactured by MSE)
- Thick film (substrates manufactured by MSE)
- HTCC (High Temperature Co-fired Ceramic)
- HDI PCB (High Density Interconnect Printed Circuit Board)
- Rigid-flex PCB
- DCB (Direct Bonded Copper)
- Thin film
- MCM (Multi Chip Modules)
- SiP (System in Package)
The MSE team works with the following design systems and interfaces:
- Altium Designer
- CAM 350
- Gerber + aperture table
- Extended Gerber preferred
- DXF
- HPGL
- Graffy/Hyde
R&D projects
MSE is participating in various government funded research and development projects to maintain its leading position in the electronics world.
In addition to other projects, MSE is currently working on:
BiSWind
Miniaturized and energy autonomous sensor elements based on complex 3D-shaped LTCC substrates to facilitate real time supervision of wind turbine shaft systems
MultiMat
Multi material systems for enhanced sensor integration and miniaturization based onceramic substrates by additive manufacturing processes
MecDruForm
Plastic films by combining printing technologies
MSE was founded as a supplier of electronic modules for implantable pacemakers. The development and manufacture of modules for life-sustaining medical devices and other critical applications characterise the quality awareness and the management system of MSE.
Every employee's activities are highly focused on customer requirements plus the quality and reliability of all products and services.Continual improvement of all processes, ongoing training and further education as well as the careful and efficient use of all resources are further cornerstones of MSE's uncompromising quality policy.
During manufacturing, MSE guarantees complete traceability of materials and processes. A wide range of manufacturing tests, stress tests and other means of analysis is available to demonstrate the performance of components and modules.
Today, the effectiveness of MSE's quality system is confirmed by official certification to ISO 13485, ISO 9001 and ISO 50001.
Inspection and Test
- X-Ray and CT
- 01005 and fine-pitch inspection
- Combined 2D / 3D CT-operation
- Solder joint analysis
- Package inspection - Scanning Acoustic Microscopy
- Detection of delamination, cracks, voids and porosity - Optical surface scan
- Cross sectioning
- Temperature cycling (-65°C/+250°C)
- Hermeticity test
- Wire pull test
- Component shear test
- Flying probe tester
- Contamination measurement
- X-ray fluorescence method
- SEM/EDX (external service)
Publications
MSE has published a wide range of papers in the field of ceramic circuits and in the field of assembly and packaging. If you are interested in receiving the full paper please contact MSE under following e-mail address: info.msegmbh(at)mst.com.
Publications in the field of assembly and packaging
Miniaturization for Implants and Other Medical Products Employing Ultra-Fine Pitch Flip Chip Technology
Dohle, R., Goßler, J., Friedrich, T., Wirth, A., Gorywoda, M.,
JMEPTEC/SMTA Medical Electronics Symposium, Marylhurst University, Marylhurst, Oregon, 2015
Small Form-Factor, Liquid-Cooled SiuPM Module for PET/MRI Applications
Dohle, R., Rittweg, T., Sacco, I.,
EMPC, Warsaw, 2017
New Assembly Technology for VCSEL Arrays Comprising Ultra-Thin Diodes
Dohle, R., Friedrich, T., Guo, J, Goßler, J.,
EMPC 2019, Pisa, 2019
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays
Dohle, R., Henning, G., Wallrodt, M., Greus, G., Neumeyr, C.,
IMAPS, 2021
New Packaging Technology for Disruptive 1- and 2-Dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications
Dohle, R., Henning, G., Friedrich, T., Wallrodt, M., Greus, G., Neumeyr, C., Rosskopf, J., Kemeter, M.,
IEEE 72nd Electronic Components and Technology Conference, San Diego, CA, 2022
New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications
Dohle, R., Friedrich, T., Henning, G., Wallrodt, M., Greus, C., Rosskopf, J., Hohenleitner, R., Neumeyr, C.,
International Microelectronics and Packaging Symposium, Boston, MA, 2022
LTCC-Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging
R. Dohle, I. Sacco, Th. Rittweg, Th. Friedrich, G. Henning, J. Goßler, P. Fischer,
Journal of Microelectronics and Electronic Packaging, 2018
Study on electromigration in flip chip lead-free solder connections with 40 µm or 30 µm diameter on thin film ceramic substrates
Gorywoda M., Dohle R., Kandler B., Burger B.,
IMAPS International Symposium on Microelectronics, Orlando, Florida, October 26 - 29, 2015
On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration
Dohle, R., Gorywoda, M., Wirth, A., Burger, B., Goßler, J.,
ECTC, San Diego, California, May 26 - 29, 2015
Investigation of electromigration behaviour in lead-free flip-chip solder connections
Dohle, R., Gorywoda, M., Wirth, A., Goßler, J.,
5th Electronics System-Integration Technology Conference, Helsinki, Finland, September 16 - 18, 2014
Small to Mid Quantity SDBGA Packaging Line for Active Medical Implants: Conception, Implementation and Challenges
Perrone, R., Goßler, J.,
Micro Systems Engineering GmbH, Medical Electronics Symposium, Lake Oswego, Oregon, September 18 - 19, 2014
Langzeitstudie zur Elektromigration in bleifreien Flip Chips mit Lotkugeldurchmessern von 50 µm oder 60 µm und ENIG-Finish auf der Chip- und Leiterplattenseite
Marek Gorywoda, Dr. Rainer Dohle, Andreas Wirth, Bernd Burger, Jörg Gossler,
4. Landshuter Symposium Mikrosystemtechnik, Landshut, 12./13.03.2014
Produktionsprozesse für Stacked Die Ball Grid Arrays
Jörg Gossler,
Fachseminar "Innovationen in der Aufbau- und Verbindungstechnik", Nürnberg, 30.01.2014
Long-Term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 µm or 60 µm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side
Gorywoda, M., Dohle, R., Härter, S., Wirth, A., Goßler, J., Franke, J.,
Proceedings of the 46th International Symposium on Microelectronics, Orlando, Florida, September 29 - October 3, 2013
Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 µm and 60 µm Diameter
Dohle, R., Härter, S., Wirth, A., Goßler, J. Gorywoda, M., Reinhardt, A., Franke, J.,
Proceedings of the 45th International Symposium on Microelectronics, San Diego, California, September 9-13, 2012
Reliability Study of Lead-Free Flip-Chips with Solder Bumps Down to 30 µm Diameter
Härter, S., Dohle, R., Reinhardt, A., Goßler, J., Franke, J.,
Proceedings 62nd Electronic Components and Technology Conference, San Diego, California, 2012
Zuverlässigkeit hochminiaturisierter Flip-Chip Baugruppen mit Leiterplatten in Subtraktivtechnologie
Dohle, R., Friedrich, T., Goßler, J., Georgiev, G.,
DVS/GMM-Tagung Elektronische Baugruppen und Leiterplatten, Fellbach, Februar 2012
Packaging eines Beschleunigungssensors für aktive medizinische Implantate
R. Perrone, T.Friedrich und J. Goßler,
Deutsche IMAPS-Konferenz 2012
Assembly und Packaging von Elektronikmodulen für medizinische Implantate
Jörg Goßler,
ZVEI AVT-Expertentreffen 2011; Frankfurt, 6.12.2011
Accelerated Life Tests of Flip-Chips with Solder Bumps Down to 30 µm Diameter
Dohle, R., Härter, S., Goßler, J., Franke, J.,
Proceedings of the 44th International Symposium on Microelectronics, Long Beach, California, October 9-13, 2011 (Best Paper Award)
Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30 µm
Oppert, T., Dohle, R., Franke, J., Härter, S.,
Proceedings of the 44th International Symposium on Microelectronics, Long Beach, California, October 9-13, 2011
Assembly and Packaging von Elektronikmodulen für medizinische Implantate - ein Überblick
R. Perrone, J. Gossler,
DVS-Tagung AG-Bonden, Oberbärenburg, Juni 2011
Processing and Reliability Analysis of Flip-Chips With Solder Bumps Down to 30 µm Diameter
Franke, J., Dohle, R., Schüßler, F., Oppert, T., Friedrich, T., Härter, S.,
Proceedings 61st Electronic Components and Technology Conference, Lake Buena Vista, FL, 2011
Solder Bumping and Processing of Flip-Chips with a Solder Bump Diameter of 30 μm or 40 μm
Oppert, T., Dohle, R., Schüßler, F., Franke, J.,
Proceedings International Conference on Electronics Packaging (ICEP) 2011, Nara, Japan, 2011
Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper Wire
Dohle, R., Petzold, M., Klengel, R., Schulze, H., Rudolf, F.,
Microelectronics Reliability (Elsevier) 51 (2011)
Kontaktierungsverfahren und Prozesstechnik für Ultra-Fine-Pitch-Baugruppen
Autorenkollektiv,
Verlag FAPS-TT GmbH, Nürnberg 2010, ISBN 978-3-87525-313-9
Passive Integration für LTCC Mikrowellen-Module - Technologie und Design Optimierung
Rubén Perrone, Jens Müller,
Deutsche IMAPS-Konferenz 2010
State of the Art of Assembly and Packaging of Electronic Modules for Medical Implants
Jörg Goßler,
iNEMI Medical Packaging Workshop; September 17, 2010, Berlin
Adapted Assembly Processes for Flip-Chip Technology With Solder Bumps of 50 µm or 40 µm Diameter
Dohle, R., Schüßler, F., Friedrich, T., Goßler, J., Oppert, T., Franke, J.,
Proceedings 3rd Electronic System-Integration Technology Conference (ESTC), Berlin, 2010
Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips
Dohle, R., Schüßler, F., Friedrich, T., Goßler, J., Oppert, T., Franke, J.,
2. Landshuter Symposium Mikrosystemtechnik, Landshut, 2010
Hochpolige Fine-Pitch-Ball-Grid-Array-Baugruppen mit niedrigschmelzenden Lotwerkstoffen
Dohle, R. Goßler, J., Kemethmüller, S., Pohlner, J., Dünne, T.,
Vortrag auf dem Spezialseminar (BFE-13sp) niedrigschmelzende Lotwerkstoffe bei Loewe-Opta, 7. September 2010
Assembly und Packaging von Elektronikmodulen für medizinische Implantate - ein Überblick
Jörg Goßler,
SMT / Hybrid / Packaging; 9. Juni 2010, Nürnberg
Bereitstellung kleinster Lotmengen bei feinsten Anschlussstrukturen
Dohle, R.,
Abschlusspräsentation ProUFP, 14. April 2010, BMBF-Förderkennzeichen 02PG2361
Flip-Chip-Technologie - fit für künftige Anforderungen ?
Jörg Goßler,
25. µTP-Workshop "ProUFP"; 14. April 2010, Nürnberg
Automatisierte Bestückung und Underfill von Ultra-Fine-Pitch Flip-Chips
Rainer Dohle, Thomas Friedrich, Jörg Goßler,
2. Landshuter Symposium Mikrosystemtechnik; Februar 2010, Landshut
Publications in the field of LTCC and thick film circuits
LTCC-Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging
R. Dohle, I. Sacco, Th. Rittweg, Th. Friedrich, G. Henning, J. Goßler, P. Fischer,
IMAPS International Symposium on Microelectronics, October 9-12, 2017, Raleigh, North Carolina, USA
Embedded Cavity based Dielectric Loss Measurements for LTCC Substrates up to 110 GHz
A. Talai, F. Steinhaußer, A. Bittner, U. Schmid, R. Weigel, D. Schwanke, Th. Rittweg, A. Koelpin,
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), August 11-14, 2015, Ottawa, Canada
LTCC Based Microfluidic Mass Flow Sensor Concept
C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Journal of Microelectronics and Electronic Packaging (2012) 9, 87-96
Micro Fluidic Mass Flow Sensor Concept for Functional Ceramic Circuits
C. Zeilmann, T. Haas, A. Backes, U. Schmid,
Paper Ceramic Interconnect & Ceramic Microsystems Technologies CICMT 2012 Erfurt
Verbundprojekt AeroSens, Ziele und Struktur des Projektes, Testvehikel-Fertigung durch MSE
Dieter Schwanke, Jürgen Pohlner, Cluster AeroSens,
Deutsche IMAPS Konferenz, München, 2012
Optimization of silver paste for flexography printing on LTCC substrate
R. Faddoul, N. Reverdy-Bruas, A. Blayo, T. Haas, C. Zeilmann,
Journal of Microelectronics Reliability, Vol. 52, Issue 7, July 2012, ISSN 0026-2714
Investigation of Pressure Sensor Concepts for Functional Ceramic Circuits
T. Haas, C. Zeilmann, U. Schmid,
International Symposium on Ceramic Materials and Components for Energy and Environmental Applications, CMCEE, Dresden, Germany, 2012
Manufacturing Processes for Pressure Sensors Realized in LTCC
T. Haas, C. Zeilmann, U. Schmid, A. Bittner,
Konferenz Mechatronics, Linz, Austria, 2012
Investigation of Innovative Cooling Concepts for Functional Ceramic Circuits
T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
European Advanced Technology Workshop on Micropackaging and Thermal Management, IMAPS France, LaRochelle, France, 2011
Investigation on Micromachining Technologies for the Realization of LTCC Devices and Systems
T. Haas, C. Zeilmann, A. Bittner, U. Schmid,
SPIE Microtechnologies, Prague, Czech Republic, 2011
Passive Integration für LTCC-Mikrowellen-Module - Technologie- und Designoptimierung
Ruben Perrone, Dieter Schwanke, Jens Müller,
Deutsche IMAPS Konferenz, München, Oktober 2010
Design and Evaluation of an Active Cooling Concepts for Functional Ceramic Circuits
T. Haas, C. Zeilmann, A. Backes, A. Bittner, U. Schmid,
21st Micromechanics and Micro Systems Europe Workshop, MME, Enschede, The Netherlands, 2010
Entwicklung nanotechnologischer Siebbeschichtungen und daran angepasster Pastensysteme für den Fine-Line-Druck von keramischen Schaltungsträgern
D. Schwanke et. al.,
2010, Verlag Dr. Markus A. Detert, ISBN13: 978-3-934142-39-8