Semiconductor technology

The core expertise of the MST Group within the semiconductor industry lies in the area of semiconductor packaging.

Semiconductor packaging
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.

Base materials

  • LTCC
  • Al2O3
  • PCB

I/O configurations

  • Ball Grid Array (BGA)
    - Stacked Die BGA (SDBGA)
    - High Voltage BGA
  • Land Grid Array (LGA)
  • Castellation
  • Single In-Line / Dual In-Line (SIL/DIL)
  • Quad Flat Packages (QFP)

Housings

  • Non-hermetic housings using plastic/metal covers or organic coatings
  • Hermetic housings by soldering

For further information or to ask us to help you work out a specific solution, please get in touch with us.


semiconductor packaging

Downloads