The core expertise of the MST Group within the semiconductor industry lies in the area of semiconductor packaging.
Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.
The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation.
For further information or to ask us to help you work out a specific solution, please get in touch with us.
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