DYCONEX AG, an MST company and the world's leading supplier of highly complex solutions in the area of interconnect technology, has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.
Micro Systems Technologies, Inc. (MSTI), located in Mesa, Arizona, is now qualified to work on projects which are subject to ITAR or EAR regulations.
The Micro Systems Technologies (MST) Group, a global provider of innovative components and manufacturing services for high-reliability / high-performance industries, such as medical technology and aerospace & defense has experienced strong market growth in recent years. The group’s customer focused strategy and growing demand have resulted in a decision to expand our
DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016.
Advanced Packaging Workshop
January 31 - February 1, 2017
Handlery Hotel, San Diego, CA, USA
Medical Design & Manufacturing
February 7 - 9, 2017
Convention Center Anaheim, CA, USA
Hall E, Booth# 510
March 7 - 8, 2017
WeKoPa Resort & Casino, Scottsdale/Fountain Hills, AZ, USA
Bassersdorf, May 12, 2016 – DYCONEX AG, an MST company and the world's leading provider of highly complex solutions in the area of interconnect technology, will celebrate its 25th anniversary in September 2016. Even so, the company can look back upon more than 50 years of experience in the fabrication of printed circuit boards. Back in 1964, a new division within Oerlikon-Contraves devoted to the manufacturing of circuit boards was established. Brought about by the transition from the electronic tube to the transistor, printed circuits became necessary, but only limited supplies were available on the market. This situation led to Contraves developing this technology on its own. At the end of the 1970s the division had already grown to more than 200 employees and was manufacturing at three Swiss locations in Seebach, Lenzburg and Gams.
“It was an exciting and fascinating time,” reports Dr. Walter Schmidt, who joined Contraves in 1979. “There was only a scarce supply of manufacturing machinery and materials, so we had to find solutions on our own.”
In 1991, at the end of the Cold War, Contraves decided to concentrate on its core businesses, which led to a management buyout. Together with a small team, Dr. Walter Schmidt founded DYCONEX in Seebach and served as its CEO until 1999.
From the very beginning, DYCONEX has focussed on technologies that enabled the miniaturization of end-user applications. For instance, the DYCOstrate® process was developed and introduced to the public in 1992 – at that time a revolutionary technology for printed circuit board fabrication. The process is based on plasma etching and enables the fabrication of thousands of microvias simultaneously. This technology opened the door for entering into new markets such as for hearing aids.
As a result of this boom it was necessary to look for new manufacturing facilities, and this led to a move from Seebach to Bassersdorf in 2001/2002. In July 2002, the new fabrication facility running two shifts and with a significantly higher level of automation started operation at the current site in Bassersdorf.
The 21st century, with the new challenges it brings to this industry segment, has also led DYCONEX to make some strategic realignments. In 2008 the decision was made to become part of the Micro Systems Technologies (MST) Group – part of a unit that makes it possible for the company to position itself as a strong global player.
Skilled employees, continuous technological developments and investments in the latest fabrication processes make DYCONEX the leading manufacturer of highly complex circuit boards which are used in a variety of industries. Among them are applications in medical technology, telecommunications, industrial electronics plus aeronautics and aerospace.
“Our goal is to remain the world's leading supplier of complex, miniaturized solutions with extreme reliability in interconnect technology and further expand our position over the next 25 years," emphasizes Dr. Hubert Zimmermann, CEO of DYCONEX AG. “First, though, we look forward to celebrate these first 25 years with all our employees this coming September.”
About DYCONEX AG:
With more than 50 years of experience, DYCONEX is one of the leading provider of highly complex flexible, rigid-flex and rigid Ultra-HDI / HDI (high-density interconnect)/microvia printed circuit boards for every application where miniaturization, functionality increase, quality and reliability play a role.
DYCONEX is headquartered in Bassersdorf, Switzerland, counts 180 employees today and is a company of the Micro Systems Technologies Group.
About the Micro Systems Technologies group:
The Micro Systems Technologies Group comprises four technology companies providing innovative components, engineering and manufacturing services for medical devices, especially implants, as well as other high-tech applications that demand exceptional quality, performance and reliability.
Active around the globe, the MST companies DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) offer their customers integrated solutions that range from conceptual design through series production.
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