News & Events

28.04.2016

MST strengthens its sales force in Israel with E.D.E. Electronics as representative

The Micro Systems Technologies Group (MST) is pleased to welcome E.D.E. Electronics Ltd. as new representative in Israel.

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08.09.2015

DYCONEX invests in a new high-precision drilling and routing machine from Schmoll

DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH.

MST at IMAPS New England 2016 - USA

IMAPS
Microelectronics & Packaging
May 3, 2016
Holiday Inn Conference Center, Boxborough, MA, USA
Booth# 609

Micro Systems Engineering GmbH (MSE) at SENSOR+TEST 2016

SENSOR+TEST

Measuring, Testing, Monitoring
May 10 - 12, 2016
Messezentrum Nuremberg, Germany
Hall 1, Booth# 209

MST at IMS 2016 International Microwave Symposium

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Microwave Technology
May 24 - 26, 2016
Moscone Center, San Francisco, CA, USA
Booth# 549

DYCONEX at ILA Berlin 2016

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The focal point of aerospace
June 1-4, 2016
Berlin ExpoCenter Airport
Hall ILA6, Booth# 620

MST at MD&M East New York 2016

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Medical Design & Manufacturing
June 14 - 16, 2016
Jacob K. Javits Convention Center, New York, NY, USA
Hall 3, Booth# 557

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.