Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of five technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.,
VascoMed GmbH.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology and EMS, semiconductor packaging processes, ASIC design and test, battery technologies, hermetic feedthroughs as well as catheter technology.


News & Events

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05.08.2014

Micro Systems Engineering, Inc. Open House

Micro Systems Engineering, Inc. (MSEI) invites you to visit Lake Oswego campus to learn about their implantable electronics products and capabilities.

The open house will feature a presentation covering MSEI's product line and MST capabilities, followed by factory tours of electronic module manufacturing facility.

Open House Date & Hours: September 17, 2014, 3:00 pm - 5:30 pm
Location: 6024 SW Jean Road, Lake Oswego, OR (Event held in Building A)

For sign-up information, please refer to attached flyer.

The MSEI team looks forward to welcoming you at their premises.

MST at Medical Manufacturing Asia 2014

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Manufacturing Processes for Medical Technology 
September 9 - 11, 2014
Suntec, Singapore
Booth# 4E20

MST at Medical Electronics Symposium 2014

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Electronic technologies and advanced manufacturing
September 18 - 19, 2014
Marylhurst University, Portland, OR, USA

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.

Catheter and catheter systems

Catheters and catheter systems

Electrophysiological diagnostics, temporary cardiac stimulation, catheter ablation, lead extraction and neurology are among the fields of application for our innovative catheters and catheter systems.