News & Events

litronik_tuev_sued_216px
22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

dyconex_ist_labor
07.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG, an MST company and a world leading supplier of highly complex solutions in the area of electronic interconnect technology, recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

en9100_logo
09.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

28.11.2016

Micro Systems Technologies, Inc. receives ITAR registration

Micro Systems Technologies, Inc. (MSTI), located in Mesa, Arizona, is now qualified to work on projects which are subject to ITAR or EAR regulations.

bakerbob_216px
02.11.2016

Micro Systems Technologies expands its sales organization for US East Coast

The Micro Systems Technologies (MST) Group, a global provider of innovative components and manufacturing services for high-reliability / high-performance industries, such as medical technology and aerospace & defense has experienced strong market growth in recent years. The group’s customer focused strategy and growing demand have resulted in a decision to expand our US organization. MST is pleased to welcome Robert F. Baker to the company.

MST at EMPC - European Microelectronics & Packaging Conference 2017

empc_108px
Microelectronics & Packaging
September 10 - 13, 2017
University of Technology, Warsaw, Poland

DYCONEX at PCB West 2017

pcb_west_108px

PCB Industry
September 13, 2017
Convention Center, Santa Clara, CA, USA
Booth# 200

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.