Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of four technology companies with many years of experience:
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology, advanced assembly technologies, semiconductor packaging processes, battery technologies as well as hermetic feedthroughs.

News & Events


DYCONEX invests in a new high-precision drilling and routing machine from Schmoll

DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen GmbH.

MST at MD&M West Anaheim 2016

MD&M West

Medical Design & Manufacturing
February 9 - 11, 2016
Convention Center Anaheim, CA, USA
Hall E, Booth# 510

MST at Medical Devices Meetings 2016


B2B Forum for Medical Devices Industry
February 24 - 25, 2016
Liederhalle, Stuttgart, Germany

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2016 - USA

Device Packaging
March 15 - 16, 2016
WeKoPa Resort & Casino, Scottsdale/Fountain Hills, AZ, USA


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.