News & Events

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

 

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31.10.2017

DYCONEX automates production processes with robots

DYCONEX AG increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

Micro Systems Engineering GmbH (MSE) at IMAPS Seminar 2018

IMAPS

Zuverlässigkeit ist kein Zufall! Design, Material, Technologie, Simulation und Test
March 3, 2018
Fraunhofer IZM, Berlin

Presentation by Joerg Gossler:

SDBGA-Packaging für kleine und mittlere Stückzahlen zum Einsatz in aktiven medizinischen Implantaten: Konzeption, Umsetzung, Zuverlässigkeit

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# 28

Micro Systems Engineering GmbH (MSE) at Microwave & RF 2018

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Radiofrequencies, microwaves, wireless and optical fibre
March 21 - 22, 2018
Paris Expo - Porte de Versailles, Paris, France
Hall 5.3, Booth# H7

MST at MEDTEC Europe 2018

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 17 - 19, 2018
Messe Stuttgart, Germany
Swiss Pavilion Booth# 10C23F

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Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.