News & Events

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

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07.02.2017

DYCONEX installs its fourth IST testing machine

DYCONEX AG, an MST company and a world leading supplier of highly complex solutions in the area of electronic interconnect technology, recently installed its fourth IST (interconnect stress test) testing machine and in doing so further upgraded its Center of Competence for product reliability.

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09.01.2017

DYCONEX successfully achieves EN 9100:2009 certification

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

DYCONEX at Airtec 2017

Airtec

The global aerospace supply chain in one place
October 24 - 26, 2017
AeroExpoPark Next to Munich Airport, Germany
Booth G85

MST at COMPAMED 2017

COMPAMED

High tech solutions for medical technology
November 13 - 16, 2017
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at IMAPS Advanced Packaging for Medical Microelectronics 2018 - USA

IMAPS
Advanced Packaging Workshop
January 23 - 24, 2018
Handlery Hotel, San Diego, CA, USA
Booth# tbd

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.