Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of four technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology, advanced assembly technologies, semiconductor packaging processes, battery technologies as well as hermetic feedthroughs.


News & Events

MST at Neurotech Leaders Forum 2014

neurotech_leaders_forum_108px

Neurotechnology Industry 
October 20 - 21, 2014
Doubletree San Francisco Airport North, San Francisco, CA, USA

Micro Systems Engineering GmbH (MSE) at electronica 2014

electronica

Electronic Components, Systems and Applications
November 11 - 14, 2014
Messe München, Germany
Hall A2, Booth# 160

MST at COMPAMED 2014

COMPAMED

High tech solutions for medical technology
November 12 - 14, 2014
Messe Düsseldorf, Germany
Hall 8a, Booth# 8aC03

MST at Advanced Technology Workshop on Microelectronics 2014, France

IMAPS
Workshop on Microelectronics, Systems & Packaging for Medical Applications
December 9 - 11, 2014
Metropole Congress Hotel, Lyon, France

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.