News & Events

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01.02.2018

DYCONEX opts for automated guided vehicles

DYCONEX AG successfully tests the production use of self-driving transport robots with a view to automating internal goods flows between departments and clean room zones.

 

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31.10.2017

DYCONEX automates production processes with robots

DYCONEX AG increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

DYCONEX at S.E.E. 2018

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Skandinavian Electronics Event
April 24 - 26, 2018
Kistamässan Science Citx
Hall C, Booth# C11:33

MST at IMAPS New England 2018 - USA

IMAPS
Microelectronics & Packaging
May 1st, 2018
Boxboro Regency Hotel, Boxborough, MA, USA

Micro Systems Engineering GmbH (MSE) at MiNaPAD Forum 2018

IMAPS
Micro/Nano-Electronics Packaging & Assembly
May 16 - 17, 2018
World Trade Center, Grenoble, France

DYCONEX & Micro Systems Engineering GmbH (MSE) at SMT 2018

SMT HYBRID PACKAGING 2017

SMT/HYBRID/PACKAGING
June 5 - 7, 2018
Messezentrum Nuremberg, Germany
DYCONEX: Hall 5 & Booth# 211-C
MSE: Hall 4, Booth# 441

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.