Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of four technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology, advanced assembly technologies, semiconductor packaging processes, battery technologies as well as hermetic feedthroughs.


News & Events

05.05.2015

Global MES workshop at Micro Systems Engineering, Inc.

Lake Oswego, May 5, 2015 - Micro Systems Engineering, Inc. (MSEI), an MST company and a leading specialist in the development and manufacture of electronic modules for active medical implants, will host the upcoming CAMSTAR MES (Manufacturing Execution System) workshop and offers a manufacturing plant tour as part of the program on May 19, 2015 in Lake Oswego, OR.

Micro Systems Engineering GmbH (MSE) at European Microwave Week 2015

euMW_108px

Microwave, RF, Wireless & Radar
September 6 - 11, 2015
Palais des Congrès, Paris, France
Booth# 189

Micro Systems Engineering GmbH (MSE) at EMPC - European Microelectronics & Packaging Conference 2015

IMAPS
Microelectronics
September 14 - 16, 2015
Graf-Zeppelin-Haus, Friedrichshafen, Germany
Booth# A15

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.