Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of four technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology, advanced assembly technologies, semiconductor packaging processes, battery technologies as well as hermetic feedthroughs.


News & Events

21.01.2015

Micro Systems Engineering completes cleanroom expansion

Lake Oswego, January 21st, 2015 - Micro Systems Engineering, Inc. (MSEI), an MST company and a leading specialist in the development and manufacture of electronic modules for active medical implants, has expanded cleanroom capacity with a state of the art cleanroom, bringing total cleanroom area to 20'000 square feet.

MST at Biomedical Device Conference 2015 - USA

sjsubmes_108px
Healthcare Industry
March 31, 2015
San Jose State University, San Jose, CA, USA

Micro Systems Engineering GmbH (MSE) at Microwave & RF 2015

microwave_108px

Radiofrequencies, microwaves, wireless and optical fibre
April 1 - 2, 2015
CNIT - Paris La Défense, France
Booth# F20

MST at RF and Microwave Packaging (RaMP) 2015

imaps-ramp_108px

RF and Microwave Packaging
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK

MST at MEDTEC Europe 2015

MEDTEC Europe

Leading European trade show for medical manufacturing industry
April 21 - 23, 2015
Messe Stuttgart, Germany
Hall 3, Booth# 3E28

MST at MEDTEC Japan 2015

medtec_japan_108px

Medical Device Manufacturing & Design Technology 
April 22 - 24, 2015
Tokyo Big Sight, Tokyo, Japan
Swiss Medtech Pavilion

MST at 7th International IEEE EMBS Neural Engineering Conference


NER_2015

April 22 - 24, 2015
The Corum, Montpellier, France

A poster presentation will be held on:
Complex, multilayer liquid crystal polymer lead structures qualified for direct biocompatible implants

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.