News & Events

Roboterhandling-Laser_208px
31.10.2017

DYCONEX automates production processes with robots

DYCONEX AG increases productivity in production through targeted use of robot handling systems for loading and unloading laser machines.

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22.08.2017

LITRONIK accomplishes EN ISO 13485:2016 certification

LITRONIK, an MST company and a specialist in the development and manufacture of compact, ultra reliable batteries for active implants, has successfully completed EN ISO 13485:2016 certification, the international standard for quality management systems for medical devices.

MST at IMAPS Advanced Packaging for Medical Microelectronics 2018 - USA

IMAPS
Advanced Packaging Workshop
January 23 - 24, 2018
Handlery Hotel, San Diego, CA, USA

DYCONEX at EIPC Winter Conference

eipc

Network of Professionals of the Electronics Industry
February 1 - 2, 2018
Lyon, France

Speech by Dr. Marc Hauer, Manager R&D DYCONEX:
'Miniaturized Hermetic Modules for Sensor Integration'

MST at MD&M West Anaheim 2018

MD&M West

Medical Design & Manufacturing
February 6 - 8, 2018
Convention Center Anaheim, CA, USA
Hall E, Booth# 618

MST at Medical Development Group (MDG) Boston Forum 2018 - USA

mdg_boston

Forum: Wearables Technologies: Advances for Medical Care
February 7, 2018
05:30 - 08:30 pm
Regis College, Fine Arts Center, Weston, MA, USA

MST at IMAPS Device Packaging 2018 - USA

IMAPS
Device Packaging
March 6 - 7, 2018
We-Ko-Pa Resort & Conference Center, Scottsdale/Fountain Hills, AZ, USA
Booth# tbd

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Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.