Micro Systems Technologies

Our comprehensive solutions, services and components are used first and foremost in medical technology, especially in active implants. However, other high-tech industries also count on our innovative products and longtime experience.

Micro Systems Technologies

The globally active MST Group consists of four technology companies with many years of experience:
DYCONEX AG,
LITRONIK Batterietechnologie GmbH,
Micro Systems Engineering GmbH,
Micro Systems Engineering, Inc.

Micro Systems Technologies

The spectrum of technologies within the MST Group is extremely wide. Among the core areas of expertise at MST are interconnect technology, advanced assembly technologies, semiconductor packaging processes, battery technologies as well as hermetic feedthroughs.


News & Events

21.01.2015

Micro Systems Engineering completes cleanroom expansion

Lake Oswego, January 21st, 2015 - Micro Systems Engineering, Inc. (MSEI), an MST company and a leading specialist in the development and manufacture of electronic modules for active medical implants, has expanded cleanroom capacity with a state of the art cleanroom, bringing total cleanroom area to 20'000 square feet.

DYCONEX & Micro Systems Engineering GmbH (MSE) at IMAPS 2015 - USA

IMAPS
Device Packaging
March 17 - 18, 2015
WeKoPa Resort & Casino, Scottsdale/Fountain Hills, AZ, USA

MST at Biomedical Device Conference 2015 - USA

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Healthcare Industry
March 31, 2015
San Jose State University, San Jose, CA, USA

Micro Systems Engineering GmbH (MSE) at Microwave & RF 2015

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Radiofrequencies, microwaves, wireless and optical fibre
April 1 - 2, 2015
CNIT - Paris La Défense, France
Booth# F20

MST at RF and Microwave Packaging (RaMP) 2015

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RF and Microwave Packaging
April 16, 2015
Weetwood Hall Conference Centre, Leeds, UK

Careers


Products and Services

Printed circuit boards

PCBs and chip-packaging substrates

High-density interconnect (HDI)/microvia printed circuit boards and chip-packaging substrates for every application where miniaturization, high performance, high frequencies and reliability play a role.

Low temperature co-fired ceramic

LTCC (Low Temperature Co-fired Ceramic)

This multilayer ceramic technology provides complex substrate solutions for avionic, space, radar, automotive or sensor applications.

Advanced assembly

Advanced assembly

State-of-the-art manufacturing equipment and inspection technologies enable the assembly of an extremely wide range of components on a wide range of base materials for the production of complex, miniaturized electronic modules.

Semiconductor packaging

Semiconductor packaging

Various customized packaging solutions are offered for a wide range of possible base materials, I/O configurations and housing types.

Primary batteries for active implants

Primary batteries

High-performance energy sources using electrochemical systems based on lithium-iodine and lithium-manganese dioxide for active medtech implants like pacemakers, defibrillators or neurostimulators.

Hermetic feedthroughs

Hermetic feedthroughs

Ceramic-to-metal, glass-to-metall or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical implants, implantable batteries and sensors.